Direct-to-Chip (DTC) Cooling
ProductsDirect-to-Chip (DTC) Cooling

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Split design for retrofit applications

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Integrated design for OEM implementations

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Double-sided design for maximizing cooling performance

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Embedded tube design for space-constrained applications

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Heat flux capabilities up to 200W/cm²(single-phase)

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Temperature uniformity within 3°C across the cold plate

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Pressure drop optimized for system efficiency

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Copper-aluminum composite construction balancing performance and weight

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Microchannel technology for maximizing surface area

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Advanced interface materials minimizing thermal resistance

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Explanation of the design process for application-specific solutions

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Examples of specialized cold plates for unique requirements